IC selectively connecting logic and bypass conductors...

Details IC selectively connecting logic and bypass conductors... IC selectively connecting logic and bypass conductors...

2008-04-22

2008-04-22

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

Reexamination Certificate

active

11738033

ABSTRACT:
In a functional mode, the functional core logic of a die is connected to the input and output pads and the die performs its intended function. In a bypass mode, the input and output buffers of the functional core logic are disabled and pad sites of corresponding position between a first set of opposite sides and between a second set of opposite sides are electrically connected. In bypass mode the die is transformed into a simple interconnect structure between the first sides and between the second sides. The interconnect structure includes plural conductors extending substantially parallel to one another between the first sides and further plural conductors extending substantially parallel to one another between the second sides. While in bypass mode, signals from a tester apparatus can flow through the conductors between the first sides and between the second sides to access and test a selected die on a wafer.

REFERENCES:
patent: 5644251 (1997-07-01), Colwell et al.
patent: 5760643 (1998-06-01), Whetsel
patent: 2245681 (1990-10-01), None

Affiliated with

Also associated with

Rating

IC selectively connecting logic and bypass conductors... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with IC selectively connecting logic and bypass conductors..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC selectively connecting logic and bypass conductors... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3922091