IC packaging interposer having controlled impedance or...

Details IC packaging interposer having controlled impedance or... IC packaging interposer having controlled impedance or...

2007-12-18

2007-12-18

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C439S065000, C439S075000

Reexamination Certificate

active

11062112

ABSTRACT:
Disclosed are embodiments of an integrated circuit die interconnection interposer suited to controlled high performance transmission of electronic or optical signals or combinations thereof. The various embodiments are designed to provide direct path interconnections away from the surface of one or more integrated circuit die. The structures are amenable to improved thermal management and can be fabricated on at semiconductor wafer.

REFERENCES:
patent: 5296652 (1994-03-01), Miller, Jr.
patent: 5633479 (1997-05-01), Hirano
patent: 5654528 (1997-08-01), Tanaka
patent: 6590479 (2003-07-01), Yoshida et al.

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