IC packages with internal heat dissipation structures

Details IC packages with internal heat dissipation structures IC packages with internal heat dissipation structures

2006-06-16

2011-10-04

Bui, Hung S (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C361S767000

Reexamination Certificate

active

08031484

ABSTRACT:
An IC package includes a substrate and a plurality of thermal dissipating vias perforating the substrate. The substrate includes a power plane, a ground plane, and a dielectric layer disposed between the power plane and the ground plane. The power plane includes a power region and a non-power region isolated from each other. The thermal dissipating vias are connected to the non-power regions of the power plane and to the ground plane.

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International Search Report dated Sep. 20, 2007 for PCT/CN2007/070126 in 5 pages.

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