Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1999-01-25
2001-10-16
Gaffin, Jeffrey (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S050510, C174S261000, C257S690000, C361S772000, C361S774000
Reexamination Certificate
active
06303875
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to IC packages and a circuit device using the same and more particularly to those used in a liquid crystal display.
2. Description of the Related Art
Several IC packages are used in a liquid crystal display. For instance, an IC package having 120 pins or an IC package having 128 pins for a liquid crystal controller ASIC is mounted on a wiring board. In such a case, it is necessary to prepare a wiring board having wires corresponding to the respective number of pins as the wiring board on which such IC package is mounted.
However, there is a case of adopting both IC packages of 120 pins and 128 pins recently in order to accommodate to multiple vendors. In such a case, two kinds of wiring boards corresponding to the respective ones must be prepared, bringing about problems that it increases the cost and is disadvantageous also in terms of production management.
Accordingly, In view of such problems, it is an object of the present invention to provide IC packages which make it unnecessary to prepare a plurality of wiring boards even when different types of IC packages are used and to provide a circuit device using such IC packages.
SUMMARY OF THE INVENTION
An inventive IC package whose plane shape is rectangular and having (n+2) pins projecting from each edge is arranged such that its plane shape is the same and intervals and positions of the pins projecting from each edge are the same with another IC package whose plane shape is rectangular and having n pins projecting from each edge; and that the IC package outputs the same signal from the first and second pins of each edge and outputs the same signal from the (n+1)-th pin and the (n+2)-th pin of each edge.
A circuit device comprising an IC package in which (n+2) pins project from each edge and a wiring board on which the IC package is mounted is arranged such that the IC package has the same plane shape and the same intervals and positions of the pins projecting from each edge with another IC package whose plane shape is rectangular and which contains n pins projecting from each edge; that the IC package outputs the same signal from first and second pins of each edge and outputs the same signal from the (n+1)-th and (n+2)-th pins of each edge, respectively; and that first and second wires electrically connected respectively with the first and second pins of each edge of the IC package are short-circuited and the (n+1)-th and (n+2)-th wires electrically connected respectively with the (n+1)-th and (n+2)-th pins of each edge of the IC package are short-circuited in the wiring board.
According to the invention described above, the circuit device may be realized just by preparing one wiring board in adopting the IC package in which (n+2) pins project from each edge thereof (hereinafter referred to as a large size package) and the other IC package in which n pins project from each edge thereof (hereinafter referred to as a small size package).
That is, when the large size package is mounted on the wiring board, it operates in the same manner as the small size package because the same signal is outputted from the first and second pins and the first and second wires are short-circuited even though the outputted same signals are sent to the first and second wires, respectively.
The specific nature of the invention, as well as other objects, uses and advantages thereof, will clearly appear from the following description and from the accompanying drawings in which like numerals refer to like parts.
REFERENCES:
patent: 3805120 (1974-04-01), Cranston
patent: 5682297 (1997-10-01), Silva
patent: 5777853 (1998-07-01), Dorfmeyer
patent: 5959845 (1999-09-01), Faucher
Gaffin Jeffrey
Kabushiki Kaisha Toshiba
Norris Jeremy
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
LandOfFree
IC packages replaceable by IC packages having a smaller pin... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC packages replaceable by IC packages having a smaller pin..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC packages replaceable by IC packages having a smaller pin... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2550843