IC-packaged device

Details IC-packaged device IC-packaged device

1988-02-22

1989-09-19

LaRoche, Eugene R.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 71, 357 45, 357 80, 357 72, 174 524, 361393, 361404, 361414, H01L 2348, H01L 2944, H01R 900, H02G 1308

Patent

active

048686344

ABSTRACT:
An IC-packaged device comprises a lower plate which has wiring patterns at least on an upper surface; an upper plate which has upper surface wiring patterns and at least an opening hole and are superimposed on the lower plate when used; and a plurality of IC chips which has a lot of connecting terminal groups mounted on the upper plate. In this structure, some of the connecting terminal groups of the plurality of IC chips are wire-bonded to the wiring patterns on the upper plate, while the other of the connecting terminal groups of the plurality of IC chips pass through the opening hole in the upper plate and are wire-bonded directly to the wiring patterns on the lower plate.

REFERENCES:
patent: 3611317 (1971-10-01), Bonfeld
patent: 3784883 (1974-01-01), Duncan et al.
patent: 3959579 (1976-05-01), Johnson
patent: 4237522 (1980-12-01), Thompson
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4558171 (1985-12-01), Gantley et al.
patent: 4646126 (1987-02-01), Iizuka
patent: 4717988 (1988-01-01), Landis
patent: 4720690 (1988-01-01), Popck et al.

Affiliated with

Also associated with

Rating

IC-packaged device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with IC-packaged device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC-packaged device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-372816