IC package with power and signal lines on opposing sides

Details IC package with power and signal lines on opposing sides IC package with power and signal lines on opposing sides

2007-06-26

2007-06-26

Soward, Ida M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S678000, C257S712000, C257S713000, C257S717000, C257S720000, C257S737000, C257S738000

Reexamination Certificate

active

10931917

ABSTRACT:
A package for integrated circuits is described. The package has a package substrate with a land side and an opposite die side, a first set of low level signal connectors on the die side to connect to an IC to be carried by the package, and a second set of low level signal connectors on the die side to connect to external components. The package may have power connectors on the land side or a power supply attached to the land side. A heat spreader or cooler may be attached to the die side.

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