IC package with an implanted heat-dissipation fin

Details IC package with an implanted heat-dissipation fin IC package with an implanted heat-dissipation fin

2007-03-27

2007-03-27

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C165S185000, C257S722000, C257S796000

Reexamination Certificate

active

10642219

ABSTRACT:
An IC package with an implanted heat-dissipation fin is introduced. The IC package provides a plastic package to seal an IC chip. One end of the heat-dissipation fin is implanted inside the plastic package, and another end is left outsides for directly heat-exchanging with a surrounding heat-transfer media. By providing the implanted heat-dissipation fin, a more efficient and broader heat-dissipation path for the IC package can be established so that the total heat dissipation of the IC package can be enhanced.

REFERENCES:
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5344795 (1994-09-01), Hashemi et al.
patent: 5705851 (1998-01-01), Mostafazadeh et al.
patent: 2001/0001070 (2001-05-01), Hsu et al.

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