IC package transfer and relocation mechanism

Details IC package transfer and relocation mechanism IC package transfer and relocation mechanism

1996-08-19

1999-09-14

Valenza, Joseph E.

Conveyors: power-driven

Conveyor system for moving a specific load as a separate unit

System includes an oscillating or reciprocating load...

294 871, B65G 2500

Patent

active

059508027

ABSTRACT:
A transfer mechanism for transferring molded IC device packages or the like between different types of trays which have IC package holder nests in differently spaced arrays. The transfer mechanism includes a suction gripper assembly supported on a horizontally and vertically movable robot arm, and having four suction heads mounted separately on four support blocks on a mounting plate. The four support blocks consist of a first support block fixed in a predetermined reference position on the mounting plate, second and third support blocks movably supported on the mounting plate for movements toward and away from the first support block in perpendicularly intersecting directions, and a fourth support block movably supported on the mounting plate for movements toward and away from the first support block in a diagonal direction following movement of at least one of the second and third support blocks.

REFERENCES:
patent: 3542412 (1970-11-01), Koch et al.
patent: 4061528 (1977-12-01), Lingl
patent: 4425074 (1984-01-01), Becker et al.
patent: 4832180 (1989-05-01), Ferrero
patent: 5177434 (1993-01-01), Suzuki et al.
patent: 5575376 (1996-11-01), Colamussi

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