IC package sealing technique

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

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Details

357 70, H01L 2302

Patent

active

046298240

ABSTRACT:
An IC package with an improved seal includes a sealant penetrator in the form of a projection on each lead for penetrating the provided seal. In a preferred embodiment the penetrator is a semi-circular projection formed on the lead which penetrates the sealant material.

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