IC package inspection apparatus

Details IC package inspection apparatus IC package inspection apparatus

1994-10-24

1995-12-05

Rosenberger, Richard A.

Optics: measuring and testing

Inspection of flaws or impurities

Having predetermined light transmission regions

356240, H01L 2166

Patent

active

054734258

ABSTRACT:
An apparatus for inspecting the outward appearance of each of IC packages stored in an embossed tape includes a drive wheel having an outer periphery about which the embossed tape is wound. The drive wheel is rotatable in a vertical plane for moving the embossed tape. A pair of cameras are so mounted as to face the outer periphery of the drive wheel at its upwardly and downwardly moving portions, respectively, and are used to produce two different images of each IC package from two different angles through a cover tape bonded to the embossed tape for enclosing the IC packages. The apparatus prevents any diffused reflection of light by the cover tape and any inclination of each IC package during its inspection.

REFERENCES:
patent: 3757943 (1973-09-01), Chae et al.
patent: 4136930 (1979-01-01), Gomm et al.
patent: 4912318 (1990-03-01), Kajiura et al.

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