IC package, IC socket, and IC socket assembly

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Details

C439S264000, C439S330000, C439S525000

Reexamination Certificate

active

07361029

ABSTRACT:
An IC socket assembly includes an IC socket, constituted by: a plurality of electrical contacts; an IC package mounting surface; an insulative socket housing for holding the plurality of electrical contacts at the IC package mounting surface; and an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts so as to establish electrical connections therewith; and the IC package. The IC package has a frame member provided about the periphery of a main body thereof.

REFERENCES:
patent: 3865458 (1975-02-01), Pauza et al.
patent: 4918513 (1990-04-01), Kurose et al.
patent: 2004/0095693 (2004-05-01), Shirai et al.
patent: 2006/0052011 (2006-03-01), Goodman et al.
patent: 1006618 (2000-06-01), None

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