IC package hold-down fixture

Electric heating – Metal heating – By arc

Patent

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Details

29760, 21912182, B23K 2600

Patent

active

051754100

ABSTRACT:
The present invention involves a hold-down fixture which is usable in connection with bonding an integrated circuit package to a printed circuit board in a surface mount environment. The purpose of the fixture is to hold each of the leads of the package in intimate contact with corresponding contact pads on the printed circuit board during the bonding process. The fixture includes a base with two bars for each group of leads extending from the perimeter of the housing of the package. Together the bars compressively force the entire foot of each lead to set flatly against its pad. The bars are spaced such that an aperture, which is defined by an opening through the base and positioned between the bars, can admit a bonding means, such as a laser beam, to reflow a solder composition at the lead/pad junction. Accordingly, with the leads compressed against the pads by the bars of the fixture, and with the reflow of the solder composition by means of the laser, a good bond between each lead and pad will be formed.

REFERENCES:
patent: 4000392 (1976-12-01), Banas et al.
patent: 4461945 (1984-07-01), O'Cheskey et al.
patent: 4654505 (1987-03-01), Sciaky et al.
patent: 4697061 (1987-09-01), Spater et al.
patent: 4845335 (1989-07-01), Andrews et al.
patent: 4959522 (1990-09-01), Rossi
patent: 4970365 (1990-11-01), Chalco
patent: 4978835 (1990-12-01), Luijtjes et al.
Japanese Development in TAB Outer Lead Bonding Equipment, dated Apr. 2, 1991, 3 pages.

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