IC package heat sink fin

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing

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Details

165 803, 257722, 361709, H01L 23367, H01L 23373

Patent

active

054553822

ABSTRACT:
A fin assembly for use as a heat sink and production thereof are disclosed. The fin assembly comprises a plurality of heat dissipating plates formed by means of a multi-wire saw, and the heat dissipating plates each has a thickness t of no more than 1 mm and being spaced apart by a gap g of no more than 1.5 mm the heat dissipating plates or pins having a height h, wherein the ratio h/t is not less than 20 and the ratio h/g is not less than 15 in one embodiment and 19 in another embodiment of the invention.

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patent: 5155579 (1992-10-01), AuYeung
"The Application of Two-Phase Push-Pull Cooling Module in Pin-fin array Electronic Device," Yu-Lin Chao and Fang-Lin Chao, (Eighth Annual IEEE Semi Conductor Thermal Measurement and Management Symposium, Feb. 3-5, 1992) pp. 97-100.
Electronics International, S. W. Fields, "Grooved Substrate Boosts IC Cooling"; vol. 55, No. 17, Aug. 1982, pp. 46-48.

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