IC package having improved structure

Details IC package having improved structure IC package having improved structure

2008-03-10

2010-02-02

Leon, Edwin A. (Department: 2833)

Electrical connectors

Aligning means for dual inline package

Reexamination Certificate

active

07654862

ABSTRACT:
An electrical connector assembly comprises an insulative housing having a base, with a mating interface, and a mounting interface corresponding to the mating face. The base has peripheral walls extending upwardly from the mating face. A plurality of contacts arranged in the base of the insulative housing. At least a pair of cantilevered push fingers formed on two adjacent walls for pushing the integrated circuit module toward opposing walls. At least a support device formed on the bottom of the push finger.

REFERENCES:
patent: 5066245 (1991-11-01), Walker
patent: 6733304 (2004-05-01), Liao
patent: 6796805 (2004-09-01), Murr
patent: 7128580 (2006-10-01), Liao et al.

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