IC Package extracting mechanism used in IC socket

Details IC Package extracting mechanism used in IC socket IC Package extracting mechanism used in IC socket

1987-06-18

1989-05-23

Pirlot, David

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439152, 439159, H05K 100

Patent

active

048326100

ABSTRACT:
An IC package extracting mechanism used in an IC socket is disclosed. The socket has a socket substrate including an IC package accommodation section, and a contact for a contacting a terminal of the IC package which is accommodated in the IC package accommodating section. The socket includes a seesaw lever for pushing up the IC package. The seesaw lever has at its one end an IC package push-up lever portion disposed below the IC package accommodated in the IC package accommodation section and at its other end a push-down lever position. The IC package push-up lever portion and the push-down lever portion are able to move up and down in a seesaw motion balancing on a support disposed at the center between the portions. The socket substrate is provided with push-down means for applying push-down force to the push-down lever portion. The push-down means pushes down the push-down lever portion to move the IC package push-up lever portion up, so that the IC package will be pushed up.

REFERENCES:
patent: 4031295 (1977-06-01), Rigazio
patent: 4498047 (1985-02-01), Hexamer et al.
patent: 4623208 (1986-11-01), Kerul et al.
patent: 4669796 (1987-06-01), Carter

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