IC package connector with contacts of high density

Details IC package connector with contacts of high density IC package connector with contacts of high density

1986-05-29

1987-09-01

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

H01R 2372

Patent

active

046906460

ABSTRACT:
An IC package connector of a molded material and with closely spaced leads has a connector body, an IC package accommodation section formed in the center thereof, at least one pair of rows on opposite sides of the IC package accommodation section, each of the rows having a plurality of parallel partition walls at the same pitch and having a small thickness, a plurality of contact implanting slits defined between adjacent partition walls and having a small width, two separator walls having a thickness substantially the same as the thickness of the partition walls and disposed on the outside of the extreme end partition walls at the opposite ends of the rows and separated therefrom by a distance substantially the same as the width of the contact implanting slits, and two buffer grooves having a width substantially greater than a slit and each having one side wall formed by outside surface of the corresponding separator wall and its outer side wall formed by the inner surface of a side of the connector body, and a plurality of contacts implanted in the contact implanting slits, the presence of the buffer grooves prevents deformation of the separator walls and extreme end partition walls during molding.

REFERENCES:
patent: 4166665 (1979-09-01), Cutchaw

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