IC package connector

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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Details

439 68, H01R 909

Patent

active

056054645

ABSTRACT:
An IC connector receives an IC package which includes a plurality of J-bend type leads arranged in parallel rows along opposite sides of an IC package body. The connector includes a housing having package-receiving recess and a pair of rows of terminal-receiving passages. A plurality of stamped and formed terminals are received in the passages. Each terminal includes a contact section for contacting a respective one of the leads of the IC package, a retention section for fixing the terminal in a respective one of the passages and a tail section exposed exteriorly of the housing. The contact section of each terminal is generally channel-shaped to define a pair of rigidifying side walls extending in planes generally transverse to the side walls of the housing and a central base portion joining the rigidifying the side walls. A pair of resilient cantilevered beam portions are formed from the central base portion of the contact section and define a pair of spring contacts projecting into the recess for engaging a respective one of the leads of the IC package.

REFERENCES:
patent: Re31929 (1985-06-01), Donaher et al.
patent: Re33268 (1890-07-01), Grabbe et al.
patent: 4362353 (1982-12-01), Cobaugh et al.
patent: 4464832 (1984-08-01), Asick et al.
patent: 4651571 (1987-06-01), Petersen et al.
patent: 4679871 (1987-07-01), Egawa
patent: 4729739 (1988-03-01), Coffee et al.
patent: 4746299 (1988-05-01), Matsuoka et al.
patent: 4799897 (1989-01-01), Mogi et al.

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