IC package carrier

Special receptacle or package – For a building component – Shingle

Patent

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Details

206331, 206334, B65D 7302, B65D 8542

Patent

active

046154418

ABSTRACT:
An IC package carrier comprises an IC package support plate having a square IC package accommodation section at the center thereof; an IC package press plate having at one end thereof a handle section for causing the IC package press plate to rise from and lie down on the upper surface of the IC package support plate, at the center thereof a square press section for pressing a square IC package, at the other end thereof a hinge mechanism for coupling the IC package press plate to the IC package support plate and serving as hinges about which the IC package press plate is rotated, and two pairs of arms, one pair for connecting the handle section to the square press section and being superposed on one pair of adjacent corners of the IC package accommodated within the square IC package accommodation section of the IC package support plate and the other pair for connecting the square press section to the hinge mechanism and being superposed on the other pair of adjacent corners of the IC package; and closure retaining means provided for detachably retaining the IC package press plate in a state of having lain down on the upper surface of the IC package support plate.

REFERENCES:
patent: 3409861 (1968-11-01), Barnes et al.
patent: 4026412 (1977-05-01), Henson
patent: 4379505 (1983-04-01), Alemanni
patent: 4422547 (1983-12-01), Abe et al.
patent: 4549651 (1985-10-01), Alemanni
patent: 4556145 (1985-12-01), Putnam

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