IC package

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 71, 357 80, 361412, 361413, 361393, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

049424530

ABSTRACT:
A device for packaging many memory IC chips having a plurality of common connecting terminals on a main circuit board. A plurality of IC chips are packaged on an auxiliary board to make an IC chip unit, and a plurality of IC chip units are aligned on the main circuit board. The connections between unit-connecting terminals provided on the respective IC chip units and the main circuit board are made by means of wiring patterns on the main circuit board.

REFERENCES:
patent: 3260982 (1966-07-01), Bostwick
patent: 3300686 (1967-01-01), Johnson et al.
patent: 4439809 (1984-03-01), Weight et al.
patent: 4626961 (1986-12-01), Ono et al.
patent: 4704599 (1987-11-01), Kimmel et al.
patent: 4780792 (1988-10-01), Harris et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

IC package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with IC package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-97994

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.