IC module assembly

Details IC module assembly IC module assembly

2006-06-06

2006-06-06

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S718000, C257S777000

Reexamination Certificate

active

07057295

ABSTRACT:
An IC module assembly includes an IC module including a plurality of pads disposed on a bottom thereof, a plurality of resilient members respectively soldering to the pads, and a PCB having a plurality of conductive patterns arranged on a top thereof and corresponding to the resilient members respectively, whereby the IC module electrically connects the PCB by the resilient members abutting against the conductive patterns of the PCB.

REFERENCES:
patent: 4553192 (1985-11-01), Babuka et al.
patent: 5761036 (1998-06-01), Hopfer et al.
patent: 5786635 (1998-07-01), Alcoe et al.
patent: 6750551 (2004-06-01), Frutschy et al.
patent: 6885106 (2005-04-01), Damberg et al.
patent: 6913468 (2005-07-01), Dozier et al.

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