IC module, and wireless information-storage medium and...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Reexamination Certificate

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C174S050510, C257S676000, C361S811000

Reexamination Certificate

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06963028

ABSTRACT:
An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.

REFERENCES:
patent: 5420757 (1995-05-01), Eberhardt et al.
patent: 5844307 (1998-12-01), Suzuki et al.
patent: 6023407 (2000-02-01), Farooq et al.
patent: 6093957 (2000-07-01), Kwon
patent: 6610923 (2003-08-01), Nagashima et al.
patent: 6624743 (2003-09-01), Ikefuji et al.
patent: 6724638 (2004-04-01), Inagaki
patent: 1148733 (1997-04-01), None
patent: 1242092 (2000-01-01), None
patent: 1321410 (2001-11-01), None
patent: 0 801 358 (1997-10-01), None
patent: 1 022 677 (2000-07-01), None
European Search Report.
Chinese Office Action.
U.S. Appl. No. 10/780,856, filed Aug. 19, 2004, Inagaki et al.

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