IC leadframe processing system

Details IC leadframe processing system IC leadframe processing system

1997-11-18

1999-09-28

Briggs, William

Metal working

Plural diverse manufacturing apparatus including means for...

Including composite tool

29740, 29759, 29827, B23D 2300, B21D 4300

Patent

active

059568380

ABSTRACT:
An IC leadframe processing system for use in an IC manufacturing system, whereby IC leadframes of different types can be subjected to various lead machining processes by a single processing system without a need of various types of cutting and bending dies. The topmost leadframe is separated by a separating device one by one from a stack of leadframes stored, each having a plurality of IC chips connected thereto. The leadframe is cut into each individual packaged IC by a leadframe cutting device. Lead wires of each packaged IC are subjected to pinch cutting, dam cutting and end cutting by a cutting die and then bent into a Z shape by a bending machine.

REFERENCES:
patent: 5361486 (1994-11-01), Harmsen et al.
patent: 5636430 (1997-06-01), Uchiyama et al.
patent: 5645393 (1997-07-01), Ishii

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