IC lead retaining mechanism in IC package carrier

Details IC lead retaining mechanism in IC package carrier IC lead retaining mechanism in IC package carrier

1986-05-20

1988-02-16

Scott, J. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 52FP, 206328, H05K 716

Patent

active

047259221

ABSTRACT:
In a carrier adapted for a flat IC package with a plurality of laterally projecting IC leads and comprising a carrier substrate having an IC package accommodation section formed on the upper central surface thereof and also having a plurality of partition walls formed about the IC package accommodation section so as to project upwardly from the upper surface of the carrier substrate and define between the adjacent partition walls IC lead receiving grooves for receiving the IC leads therein and supporting the IC leads on the bottoms thereof, an IC lead retainer provided at one end with a flexible thin hinge connected integrally to one end of the carrier substrate for permitting the IC lead retainer to be rotated toward and away from the upper surface of the carrier substrate and retaining claws for retaining the IC lead retainer rotated toward the upper surface of the carrier substrate in a state of being laid down against the upper surface of the carrier substrate. The IC leads of the IC package accommodated within the IC package accommodation section are retained between the IC lead retainer and the carrier substrate.

REFERENCES:
patent: 202937 (1865-11-01), Foshee et al.
patent: 3353656 (1967-11-01), Brown
patent: 3615006 (1971-10-01), Freed
patent: 4007479 (1977-02-01), Kowalski
patent: 4329642 (1982-05-01), Luthi et al.
patent: 4331373 (1982-05-01), Demnianiuk
patent: 4422547 (1983-12-01), Abe et al.
patent: 4535887 (1985-09-01), Egawa
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4630095 (1986-12-01), Otsuka et al.
IBM Technical Disclosure Bulletin, Jarvela, vol. 16, No. 12, May 1974.

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