Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-10-01
2003-02-18
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S705000, C361S707000, C361S719000, C361S749000, C174S252000, C174S254000, C174S255000, C174S260000, C165S080200, C165S185000, C345S060000, C349S058000, C349S150000
Reexamination Certificate
active
06522543
ABSTRACT:
BACKGROUND OF INVENTION
The present invention relates to an IC heat radiation structure capable of effectively radiating heat emitted from the IC, and to a display device equipped with the IC heat radiation structure.
FIG. 4
is a partially sectional view shows the construction of a conventional liquid crystal display device with a direct backlight.
In
FIG. 4
, a reference numeral
11
denotes a bezel made of metal. In the bezel
11
, on a periphery of a front plate
12
molded into a picture frame shape with an aperture
13
, a sidewall
14
extended downward and perpendicularly to the front plate
12
.
A reference numeral
21
denotes a liquid crystal display panel. In the liquid crystal display panel
21
, a transparent electrode is formed on inner surfaces of two glass substrates
22
and
23
sandwiching liquid crystal. The liquid crystal display panel
21
is attached to a back surface of the front plate
12
so that the aperture
13
of the bezel
11
and a display portion of the liquid crystal display panel
21
are aligned.
A reference numeral
31
denotes a frame made of metal. In the frame
31
, on a periphery of a front plate
32
molded into a picture frame shape with an aperture
33
, a sidewall
34
extended downward and perpendicularly to the front plate
32
. The liquid crystal display panel
21
is attached to a front surface of the front plate
32
so that the aperture
33
and the display portion of the liquid crystal display panel
21
are aligned.
A reference numeral
41
denotes a tape carrier package (TCP). The TCP
41
has a printed wiring film
42
fitted with a driver IC
43
for allowing the liquid crystal display panel
21
to display images. In the TCP
41
, an electrode on one end of the printed wiring film
42
is connected to an electrode continuous with the transparent electrode of the glass substrate
23
with an anisotropic conductive film (ACF).
A reference numeral
44
denotes a control circuit substrate. In the control circuit substrate
44
, an electrode thereof is connected and fixed to an electrode on the other end of the printed wiring film
42
with the ACF or solder.
A reference numeral
45
denotes a substrate stage for supporting the control circuit substrate
44
. The substrate stage
45
is attached to the control circuit substrate
44
.
A reference numeral
51
denotes a backlight unit. The backlight unit
51
comprises: a front frame
52
having a sidewall
55
on a periphery of a front plate
53
molded into a picture frame shape with an aperture
54
, the sidewall being extended downward and perpendicularly to the front plate
53
; a rear frame
56
detachably attached to a back surface of the front frame
52
and having a reflection film attached to a surface which serves as a reflection surface; lamps
57
attached to the rear frame
56
; and a heat insulator
58
attached to an outer surface of the sidewall
55
.
A reference numeral
61
denotes an interface for supplying electric powers to the respective portions by unillustrated wiring.
Next, an operation thereof will be described.
First, electric powers are supplied to the driver IC
43
, the control circuit substrate
44
and the lamps
57
via the interface
61
.
Then, the control circuit substrate
44
operates the driver IC
43
in accordance with a signal supplied thereto, and allows the liquid crystal display panel
21
to display specified images. Thus, the images displayed on the liquid crystal display panel
21
can be visibly recognized by light from the lamps
57
.
Heat generated during the operation of the respective portions is radiated to peripheries thereof.
In recent years, accompanied with enlargement and higher definition of the liquid crystal display panel
21
, power consumption of the driver IC
43
for allowing the liquid crystal display panel
21
to display images has been increased.
Therefore, an attempt has been made for effectively radiating heat emitted from the driver IC
43
by attaching a heat radiation member such as a heat sink and a heat-conductive rubber thereto. However, since the driver IC
43
is attached to the printed wiring film
42
, direct attachment of the heat radiation member to the driver IC
43
causes a problem that disconnection tends to occur between the printed wiring film
42
and the driver IC
43
.
SUMMARY OF INVENTION
The present invention was made in order to solve the foregoing inconvenience. An object of the present invention is to provide an IC heat radiation structure capable of effectively radiating heat emitted from an IC and a display device provided with the IC heat radiation structure.
A feature of the present invention includes an IC heat radiation structure for radiating heat emitted from an IC. The IC heat radiation structure holds a TCP fitted with the IC attached to a printed wiring film. Further included is a holding member for holding the TCP, a heat-conductive interposition member disposed between the holding member and the TCP, and a heat-conductive slip member disposed between the interposition member and the TCP or between the interposition member and the holding member.
Another feature of the present invention includes an IC heat radiation structure for radiating heat emitted from an IC. The foregoing IC heat radiation structure holds a TCP with the IC attached to a printed wiring film. Further included is a holding member for holding the TCP, a heat-conductive and elastic interposition member disposed between the holding member and the TCP, and a sheet harder than the interposition member disposed so as to contact the TCP. The sheet is disposed between the foregoing interposition member and the TCP.
Yet, another feature of the present invention is an IC heat radiation structure for radiating heat emitted from an IC. The foregoing IC heat radiation structure holds a TCP with the IC attached to a printed wiring film. Further included is a holding member for holding the TCP, and a heat-conductive interposition member disposed between the holding member and both surfaces of the TCP. The TCP has a surface where a protrusion of the IC is larger (the second heat-conductive rubber
84
side in
FIG. 1
, that is, the IC side) and a surface opposite thereto. The interposition member between the holding member and the opposite surface is made harder than the interposition member between the holding member and the surface at the IC side.
Still another feature of the present invention includes an IC heat radiation structure, wherein one surface of a TCP with an IC attached to a printed wiring film is movably held, and heat emitted from the foregoing IC is radiated therefrom. In this case, the foregoing IC is desirably held movably. In addition, a surface for holding is desirably formed of a heat-conductive slip member capable of moving the TCP to an in-surface direction of the printed wiring film.
Still yet another feature of the present invention includes a display device provided with a TCP with a driver IC attached to a printed wiring film. The driver IC allows a display panel to display images. Further included is an IC heat radiation structure for radiating heat emitted from the driver IC. The IC heat radiation structure includes a holding member for holding the TCP, a heat-conductive interposition member disposed between the holding member and the TCP, and a heat-conductive slip member disposed between the interposition member and the TCP or between the interposition member and the holding member.
Still yet a further feature of the present invention is a display device provided with a TCP with a driver IC attached to a printed wiring film. The foregoing driver IC allows a display panel to display images. Further included is an IC heat radiation structure for radiating heat emitted from the driver IC. The IC heat radiation structure includes a holding member for holding the TCP, a heat-conductive and elastic interposition member disposed between the holding member and the TCP, and a sheet harder than the interposition member disposed so as to contact the TCP. The sheet is disposed between the inte
Hanzawa Fumihisa
Kurihara Mikio
Yamada Yoshihisa
Chervinsky Boris
International Business Machines - Corporation
Jennings Derek S.
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