IC Extraction tool

Metal working – Means to assemble or disassemble – Means to disassemble electrical device

Patent

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Details

29278, 29758, H05K 332

Patent

active

042154685

ABSTRACT:
An extraction tool for a packaged IC is described. The tool is characterized by gripping means for gripping opposite sides of the IC when the tool is actuated by pulling up on a slider, and for applying a uniform lifting force to the IC when the gripping means contacts the IC, to avoid deforming the IC pins.

REFERENCES:
patent: 3443297 (1969-05-01), Lusby, Jr.
patent: 3699629 (1972-10-01), Hood, Jr. et al.
patent: 3896533 (1975-07-01), Ullman et al.

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