Conveyors: power-driven – Conveyor section – Endless conveyor
Patent
1998-02-27
2000-10-10
Ellis, Christopher P.
Conveyors: power-driven
Conveyor section
Endless conveyor
1984684, B65G 2300
Patent
active
061292036
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
In an flip-chip installation equipment, the present invention relates to an IC removal device whereby ICs in respect of which an IC recognition error was found but which have no functional problems can be handled in such a way that they can be reused.
BACKGROUND ART
In recent years, flip-chip mounting has become the most common type of semiconductor mounting since it enables miniaturization of circuit boards as exemplified by MCM (Multichip Module) or CSP (Chip Size Package). Typically in flip-chip mounting, a recognition camera is employed to recognize an IC which is suck-held to a substrate or bonding head in order to perform correction of the mounting position immediately before mounting. When this is done, if the IC is dirty or its recognition attitude is tilted, an IC recognition error will occur; however, in order not to lower the working rate by stopping working of the equipment, the IC sucked by the bonding head is shifted by the bonding head to a removal position, whence it is then removed into a removal unit.
An example of a prior art IC removal device as referred to above is described below with reference to the drawings. FIG. 4 shows the layout of a prior art flip-chip mounting equipment fitted with an IC removal device. In FIG. 4, 1 indicates a bonding head, 3 indicates a recognition camera, 4 an IC and 5 a circuit board; 11 is an IC removal BOX fixed at a prescribed location. After the recognition camera 3 has recognized an IC 4, if a recognition error ensues, the bonding head 1, while sucking the IC 4, moves over to above the IC removal BOX 11 where the adhesion action is discontinued, allowing the IC 4 to drop into the IC removal BOX 11. After removing the IC 4, the bonding head 1 moves to the IC feed system, where it extracts a new IC 4 and performs a recognition operation.
However, since, in an IC removal device as illustrated above, an IC 4 is removed by its own free dropping into a removal BOX 11, the removed IC 4 gets scratched and damaged, and the IC 4 may also be electrostatically destroyed when it contacts the removal BOX 11. Thus, it is seldom that such ICs 4 can not be reused. A further problem is that it is difficult to handle the ICs 4 when they are to be re-examined, since they are removed into a removal BOX 11 without any particular care being exercised.
SUMMARY OF THE INVENTION
An object of the present invention is to solve the above problems and to provide an IC removal device for a flip-chip mounting equipment, whereby ICs can be reused.
This IC removal device comprises: a plate for carrying ICs; drive means for driving this plate to rotate or move at prescribed angular intervals or for prescribed distances; and a bonding head which, after lowering an IC until it contacts the plate, stops its action of sucking the IC whereby the ICs are removed to be lined up in a row on the plate; said IC removal device enabling the ICs to be reused.
The invention according to claim 1 comprises: a plate for carrying ICs; drive means for driving this plate to rotate at prescribed angular intervals; and a bonding head which, after lowering an IC until it contacts the plate, stops the action of sucking the IC whereby the ICs are removed to be lined up in a row on the plate.
Since the ICs are carried on a plate, they can be prevented from being scratched or damaged by their free dropping and, by setting the load under which the contact between the IC and plate is detected within a range such that a projecting electrode of the IC is not deformed, deformation of the projecting electrode of the IC does not occur, enabling removed ICs to be reused after rechecking. By rotating the plate at a fixed angle after completion of a removal action, the bonding head is enabled to perform the next IC removal action.
Also, the invention according to claim 2 comprises: a plate for carrying ICs; drive means for driving this plate to move at prescribed distance intervals; and a bonding head for lowering an IC into contact with the plate and then stopping the action of sucking the IC, so t
REFERENCES:
patent: 3189193 (1965-06-01), Merchant
patent: 4057149 (1977-11-01), Clarke
patent: 4318465 (1982-03-01), Calvert et al.
patent: 4886412 (1989-12-01), Wooding et al.
patent: 5330043 (1994-07-01), Stuckey
Kainou Naomi
Kanayama Shinji
Kiyomura Hiroyuki
Matsumura Nobuya
Nishino Kenichi
Dillon, Jr. Joe
Ellis Christopher P.
Matsushita Electric - Industrial Co., Ltd.
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