IC contact mechanism

Details IC contact mechanism IC contact mechanism

1992-02-19

1993-08-03

Hall, Carl E.

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29743, 29759, 228 62, H05K 330

Patent

active

052317536

ABSTRACT:
In case of inserting an IC having multiple pins into an IC socket so as to be brought into contact with the IC socket, a contact pressure application unit is integrated with the IC socket, whereby the IC is inserted into and brought into contact with the IC socket without bending a lead of the IC. An IC contact mechanism comprises a contact pressure application unit having a through hole at the center thereof, the contact pressure application unit also having a mold guide portion so as to contact an outer periphery of a package of an IC and a lead presser portion for pressing a lead of the IC; and a suction block having a suction pad at the tip end thereof and movable vertically in the through hole of the contact pressure application unit characterized in that the IC is inserted into a contact socket so as to be brought into contact with the contact socket while the suction pad sucks the IC.

REFERENCES:
patent: 3883945 (1975-05-01), Wallis
patent: 4528746 (1985-07-01), Yoshimura
patent: 4787548 (1988-11-01), Abbagnaro et al.
patent: 4844325 (1989-07-01), Nishiguchi et al.
patent: 5113581 (1992-05-01), Hidese

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