Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1995-05-01
1997-09-16
Ramsey, Kenneth J.
Metal fusion bonding
Process
With condition responsive, program, or timing control
228 62, 228 9, 228105, 22818022, 348 87, H01L 2158
Patent
active
056671296
ABSTRACT:
An IC component mounting method includes sucking each of different types of IC components at a supply position to which the IC component having an electrode-provided face thereof to be bonded to a circuit board, recognizing an image of the IC component to detect a sucking position at which a sucking nozzle does not interfere with an electrode of the IC component, detecting a height of the sucking position, positioning the sucking nozzle at the sucking position while the position of the sucking nozzle in a vertical direction is controlled, sucking the IC component by a mounting head, recognizing a position of the IC component sucked by the mounting head, and recognizing a reference position of the circuit board or an IC component-mounting position thereof, and positioning the IC component at the IC component-mounting position of the circuit board and then mounting the IC component on the circuit board.
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patent: 4896811 (1990-01-01), Dunn et al.
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patent: 5285946 (1994-02-01), Tomigashi et al.
patent: 5425491 (1995-06-01), Tanaka et al.
patent: 5471310 (1995-11-01), Spigarelli et al.
Kabeshita Akira
Misawa Yoshihiko
Morita Koichi
Saeki Keiji
Watanabe Nobuhisa
Matsushita Electric - Industrial Co., Ltd.
Ramsey Kenneth J.
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