IC chips with self-aligned thin film resistors

Details IC chips with self-aligned thin film resistors IC chips with self-aligned thin film resistors

1987-09-09

1989-11-07

Albritton, C. L.

Electricity: motor control systems

Specific feedback condition or device

Load or torque

338309, 338307, H01C 1012

Patent

active

048787701

ABSTRACT:
Process of making an IC chip with thin film resistors, and IC chips made by such process, wherein a chip substrate first is covered with layers of thin film and interconnect material (with an intermediate barrier layer if needed), such layers being etched away in predetermined regions in accordance with the metal interconnect pattern, the remaining layered material being aligned vertically, and thereafter, in a section of the remaining material, etching away the interconnect material (and barrier material if used) to expose the thin film material to form a thin film resistor which is self-aligned with the adjoining sections of interconnect conductors. The material in the predetermined regions may be etched by a dry-etch (plasma) or by a wet-etch.

REFERENCES:
patent: 3862017 (1975-01-01), Tsunemitsu et al.
patent: 4020222 (1977-04-01), Kausche et al.
patent: 4139833 (1979-02-01), Kirsch
patent: 4164607 (1979-08-01), Thiel et al.
patent: 4414274 (1983-11-01), Hieber

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