IC chip test socket with double-ended spring biased contacts

Details IC chip test socket with double-ended spring biased contacts IC chip test socket with double-ended spring biased contacts

1993-04-01

1996-02-06

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, 324755, G01R 1512

Patent

active

054898544

ABSTRACT:
A test socket for a surface mount IC chip includes an array of double-ended spring contacts that extend out from opposite sides of a substrate, with a positioning frame on top of the substrate for aligning a chip and its leads with the upper contact heads. The spring contacts preferably have hollow elongate bodies with contact heads extending out from opposite sides under an internal spring bias. The socket can be formed from two laminates which have a series of aligned openings for the spring contacts, with expanded midsections on the spring contacts press-fit into the laminate openings and thereby securing holding the laminates together. A standoff on the upper socket surface vertically positions the IC chip, and provides the proper contact pressure between its leads and the spring contacts. The test socket can be removably mounted to a PC test board, with a releasable clamping device such as an air cylinder used to hold a chip to be tested in place within the socket.

REFERENCES:
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VLSI Technology, 2d Ed., McGraw-Hill Book Company, 1988, pp. 569-570 (month is not available).
CIN.APSE A New Patented Technology Bringing PC Interconnects Up To Speed, by Labinal Components and Systems, Inc., 1989 (month is unavailable).
Silver Stax Elastomeric Connectors by Elastomeric Technologies, Inc., Feb. 1989.
Interconnect Devices, Inc. Catalog, 1991, pp. 26, 27 and 38 (month is unavailable).

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