Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2006-02-14
2011-11-08
Hoang, Quoc (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257SE31129
Reexamination Certificate
active
08053896
ABSTRACT:
An IC chip coating material includes first metal oxide particles; a metal alkoxide; an organic solvent; and second metal oxide particles and/or flat particles of a composite oxide, the second metal oxide particles having a composition identical to or different from that of the first metal oxide particles and also having a mean particle size and/or a shape different from that of the first metal oxide particles. Further, a vacuum fluorescent display device includes an IC chip, wherein the IC chip is at least partially coated by a coating material layer including the first metal oxide particles; a metal forming metal alkoxide; and the second metal oxide particles and/or flat particles of a composite oxide.
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Fujiwara Kouji
Kato Masahiro
Watanabe Teruo
Yasuoka Yusuke
Bacon & Thomas PLLC
Fatuba Corporation
Hoang Quoc
Tran Tony
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