Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-03-09
1996-01-09
Sparks, Donald A.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174255, 174258, 174260, 174261, 361767, 361770, 361792, 361795, H05K 702
Patent
active
054834210
ABSTRACT:
A package for mounting I/C chips onto a circuit board is provided. The chip has a surface array of input/output pads on one side which forms a footprint. A carrier is formed of an organic dielectric material having opposite surfaces. A first set of bonding pads is formed on one surface of the chip carrier and arranged to correspond with the chip footprint. A first set of solder ball connections connects the input/output pads on the chip to the first set of bonding pads on the chip carrier. A second set of bonding pads is formed on the other surface of the chip carrier forming a second set of bonding pads. Electrically conducting vias extend through the chip carrier connecting the first set of bonding pads to the second set of bonding pads. An organic circuit board having a coefficient of thermal expansion similar to the chip carrier having electrical connector sites is provided, the sites are arranged in a pattern corresponding to the pattern of the second bonding pads on the chip carrier. A second set of solder ball connections connect the pads of the second set of bonding pads on the chip carrier to the connection sites on the circuit board.
REFERENCES:
patent: 4034468 (1977-07-01), Koopman
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4415025 (1983-11-01), Horvath
patent: 4448306 (1984-05-01), Sinnadurai et al.
patent: 4595096 (1986-06-01), Sinnadurai et al.
patent: 4682270 (1987-07-01), Whitehead et al.
patent: 4724472 (1988-02-01), Sugimoto et al.
patent: 4821142 (1989-04-01), Ushifusa et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 5065227 (1991-11-01), Frankeny et al.
IBM Technical Disclosure Bulletin, vol. 18, No. 5, pp. 1440-1441.
IBM Technical Disclosure Bulletin, vol. 20, No. 8, pp. 3090-3091.
IBM Tech. Disc. Bulletin, vol. 33, No. 2, pp. 15-16.
IBM Tech. Disc. Bulletin, vol. 10, No. 12, pp. 1977-1978.
IBM Technical Disc. Bulletin, vol. 18, No. 5, pp. 1379-1380.
Research Disc., May 1990, No. 313, Kenneth Mason Publications, Ltd.
Gedney Ronald W.
Sholtes Tamar A.
International Business Machines - Corporation
Sparks Donald A.
LandOfFree
IC chip attachment does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC chip attachment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC chip attachment will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1306858