IC carrier

Electrical connectors – Aligning means for dual inline package

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Details

439330, 206724, H05K 100

Patent

active

055734278

ABSTRACT:
An IC socket includes a socket body, an IC receiving portion formed in the socket body, an engagement members for engaging an upper edge or upper surface of an IC package received in the IC receiving portion and applying a push-down force thereto, and a support members for elastically supporting the lower surface or lower edge of the IC package and applying a push-up force thereto. The IC package is held between the support members and the engagement members.

REFERENCES:
patent: 4535887 (1985-08-01), Egawa
patent: 4616895 (1986-10-01), Yoshizaki et al.
patent: 4881639 (1989-11-01), Matsuoka et al.
patent: 4887969 (1989-12-01), Abe
patent: 5199890 (1993-04-01), Kubo
patent: 5395255 (1995-03-01), Kato

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