Electrical connectors – Aligning means for dual inline package
Patent
1994-01-21
1996-11-12
Vu, Hien D.
Electrical connectors
Aligning means for dual inline package
439330, 206724, H05K 100
Patent
active
055734278
ABSTRACT:
An IC socket includes a socket body, an IC receiving portion formed in the socket body, an engagement members for engaging an upper edge or upper surface of an IC package received in the IC receiving portion and applying a push-down force thereto, and a support members for elastically supporting the lower surface or lower edge of the IC package and applying a push-up force thereto. The IC package is held between the support members and the engagement members.
REFERENCES:
patent: 4535887 (1985-08-01), Egawa
patent: 4616895 (1986-10-01), Yoshizaki et al.
patent: 4881639 (1989-11-01), Matsuoka et al.
patent: 4887969 (1989-12-01), Abe
patent: 5199890 (1993-04-01), Kubo
patent: 5395255 (1995-03-01), Kato
Vu Hien D.
Yamaichi Electronics Co. Ltd.
LandOfFree
IC carrier does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC carrier, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC carrier will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-558477