IC card rigidized cover

Details IC card rigidized cover IC card rigidized cover

1995-09-29

1996-08-20

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361736, 361752, 257679, H05K 114

Patent

active

055484859

ABSTRACT:
A cover assembly for an IC card includes top and bottom covers (52, 54) with overlapping side rails (70, 80). At each side of the card, a downwardly-extending top side rail (70) lies facewise adjacent to an upwardly extending bottom side rail (80), and a layer (90) of solder is sandwiched between the rails and is bonded to each of them. The solder layer extends along most of the height of each cover side, so the two rails and the solder layer between them serve as a single rigid beam. The cover assembly can be, instead, spot welded at a plurality of locations at each side of the card, to weld the two rails facewise together.

REFERENCES:
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patent: 2454624 (1948-11-01), Boerger
patent: 2525087 (1950-10-01), Young
patent: 2706328 (1955-04-01), Karmazin
patent: 3372310 (1968-03-01), Kantor
patent: 5242310 (1993-09-01), Leung
patent: 5313364 (1994-05-01), Omori et al.
patent: 5339222 (1994-08-01), Simmons et al.
patent: 5386340 (1995-01-01), Kurz
patent: 5397857 (1995-03-01), Farquhar
patent: 5409385 (1995-04-01), Tan
patent: 5414253 (1995-05-01), Baudouin

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