IC card module

Details IC card module IC card module

1990-11-30

1992-01-07

Thompson, Gregory D.

Electricity: electrical systems and devices

Miscellaneous

174 522, 235492, 235488, H05K 702

Patent

active

050796739

ABSTRACT:
An IC card module includes a substrate one side of which is provided with a connection terminal; and a resin-sealed semiconductor IC which has been previously sealed by a resin. This connection terminal and the resin-sealed semiconductor IC are electrically connected to each other and are covered with a molding resin. Accordingly, reliable modules can be efficiently manufactured and readily mounted on IC card substrates.

REFERENCES:
patent: 4719140 (1988-01-01), Hara et al.
patent: 4727246 (1988-02-01), Hara et al.
patent: 4737620 (1988-04-01), Mollet et al.
patent: 4746392 (1988-05-01), Hoppe
patent: 4789347 (1988-12-01), Banjo et al.
patent: 4795895 (1989-01-01), Hara et al.
patent: 4879153 (1989-11-01), Ohashi et al.

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