IC-card manufacturing apparatus

Details IC-card manufacturing apparatus IC-card manufacturing apparatus

2005-07-05

2005-07-05

Rossi, Jessica (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Chamber enclosing work during bonding and/or assembly

C156S580000, C100S305000, C100S315000

Reexamination Certificate

active

06913057

ABSTRACT:
An IC-card manufacturing apparatus manufactures an IC card from a laminated substrate including an electronic component and laminate materials which sandwich the electronic component. The IC-card manufacturing apparatus includes a laminated-substrate sandwiching unit which includes upper and lower sandwiching sections for sandwiching the laminated substrate in a sealed state; an evacuation unit for evacuating air from the interior of the laminated substrate; and an evacuation mechanism section which sandwiches the laminated-substrate sandwiching unit in order to form an upper evacuation chamber above the upper sandwiching section and a lower evacuation chamber below the lower sandwiching section and which evacuates air from the upper and lower evacuation chambers by use of the evacuation unit.

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