IC card including multiple substrates bearing electronic compone

Details IC card including multiple substrates bearing electronic compone IC card including multiple substrates bearing electronic compone

1992-11-09

1994-03-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361761, 361807, 361810, 174 521, 174255, 257678, 257686, 257700, H05K 114

Patent

active

052990940

ABSTRACT:
An IC card includes a main substrate and a plurality of sub-substrates. Each sub-substrate has two surfaces on which electronic components are installed. The sub-substrates are mounted on both surfaces of the main substrate within the IC card. Openings in the main substrate receive electronic components installed on the sub-substrates. Such an arrangement makes it possible to provide four layers of electronic components within an IC card.

REFERENCES:
patent: 4730232 (1988-03-01), Lindberg

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