IC card having improved heat dissipation

Details IC card having improved heat dissipation IC card having improved heat dissipation

1994-04-25

1996-04-16

Hajec, Donald T.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, 361705, H05K 720

Patent

active

055088856

ABSTRACT:
An IC card includes a ground pattern of high heat conductivity disposed between a substrate and a mounted element, such as a semiconductor element, and in contact with the mounted element. Heat generated by the mounted element is transmitted through the ground pattern and ground terminals to which the ground pattern is connected and radiated by a cooling system disposed outside of the IC card. Therefore, heat generated by the mounted element can be radiated efficiently and malfunctioning of the mounted element due to heat can be prevented, resulting in improved electrical reliability.

REFERENCES:
patent: 3061760 (1962-10-01), Ezzo
patent: 4475145 (1984-10-01), Heil et al.
patent: 4949225 (1990-08-01), Sagisaka et al.
patent: 5229327 (1993-07-01), Farnworth
patent: 5262922 (1993-11-01), Yamaji et al.

Affiliated with

Also associated with

Rating

IC card having improved heat dissipation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with IC card having improved heat dissipation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC card having improved heat dissipation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-329982