Electric heating – Metal heating – For bonding with pressure
Patent
1995-12-20
1998-04-14
Nguyen, Matthew V.
Electric heating
Metal heating
For bonding with pressure
361737, B23K 1100, H05K 114
Patent
active
057395004
ABSTRACT:
A system is described for completing the construction of an IC (integrated circuit) card, of the type that includes an inner unit (18) formed by a pair of connectors (14, 16) at opposite ends of a circuit board (12), and a sheet metal cover (20) with upper and lower halves (22, 24) that must be fixed together around the inner unit. The system includes front, left, and right weld units (50, 52, 54) arranged about an imaginary rectangular weld region (60), a guide rail (72) extending rearwardly from below the weld region, and a slide assembly (70) with a card-holding fixture, that can slide forwardly into the weld region and rearwardly out of the weld region. A pair of rollers (82, 84) is separately movable forwardly so flanges (86, 88) on the rollers progressively close the upper cover half on the lower one, and then movable rearwardly out of the way, so the slide assembly with a closed card can be moved into the weld region where welds are formed to fix the cover halves together. The system includes a frame (42) with a plate-like platform (44), with the weld units, guide track and slider assembly, and rollers all lying above the platform. A pair of actuators that move the slide assembly and rollers lie below the platform.
REFERENCES:
patent: 5386340 (1995-01-01), Kurz
patent: 5493477 (1996-02-01), Hirai
patent: 5495664 (1996-03-01), Semple et al.
patent: 5502620 (1996-03-01), Funck et al.
patent: 5515595 (1996-05-01), Kurz
patent: 5546278 (1996-08-01), Bethurum
patent: 5548485 (1996-08-01), Bethutum
ITT Cannon Catalog; StarCard Classic-PCMCIA I/O Card Kit; SCC-2/1094; Copyright 1994 ITT Corporation.
ITT Cannon, Inc.
Nguyen Matthew V.
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