IC card and semiconductor integrated circuit device package

Details IC card and semiconductor integrated circuit device package IC card and semiconductor integrated circuit device package

2008-04-01

2008-04-01

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C361S737000

Reexamination Certificate

active

10442959

ABSTRACT:
An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.

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Abstract for JP 1-128884, published date May 22, 1989.

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