Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2008-05-06
2009-11-10
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257S723000, C257S787000
Reexamination Certificate
active
07615855
ABSTRACT:
An IC body is loaded to a case2made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
REFERENCES:
patent: 5866950 (1999-02-01), Iwasaki et al.
patent: 6031724 (2000-02-01), Takahashi
patent: 6076737 (2000-06-01), Gogami et al.
patent: 6433285 (2002-08-01), Maeda et al.
patent: 6591494 (2003-07-01), Okamura et al.
patent: 6780668 (2004-08-01), Tsukahara et al.
patent: 6988668 (2006-01-01), Osako et al.
patent: 7427032 (2008-09-01), Osako et al.
patent: 2001/0009505 (2001-07-01), Nishizawa et al.
patent: 2002/0027274 (2002-03-01), Usami et al.
patent: 2006/0157838 (2006-07-01), Bolken
patent: 2006/0202041 (2006-09-01), Hishizawa et al.
patent: 2007/0045873 (2007-03-01), Takemoto
patent: 2001-325578 (2001-11-01), None
patent: 2002-176066 (2002-06-01), None
Higuchi Akira
Nishizawa Hirotaka
Osako Junichiro
Osawa Kenji
Miles & Stockbridge P.C.
Nguyen Cuong Q
Renesas Technology Corp.
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