IC card and method of manufacturing the same

Details IC card and method of manufacturing the same IC card and method of manufacturing the same

1995-11-28

2000-02-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361758, 235492, 257679, H05K 114, H01L 2332

Patent

active

060317248

ABSTRACT:
An IC card includes a card-like substrate, an IC module, and an adhesive. The substrate is made of synthetic resin and has in one surface a hole for fixing the IC module. The IC module has a circuit board on which an IC chip is mounted and sealed with resin. The back side of the circuit board is provided with external connecting terminals which are electrically connected to the IC chip and exposed from the card-like substrate. The IC module is fitted into the hole of the card-like substrate such that an IC chip mounting section of the IC module is located inside the IC card. Using the adhesive, the IC module is fixed onto part of the inner surface of the hole of the card-like substrate without causing the chip mounting section to contact the inner surface of the hole.

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