IC card and method of manufacturing the same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361749, 361770, 361785, 361792, 174261, 439 77, H05K 114

Patent

active

053351452

ABSTRACT:
An IC card exhibiting improved electrical insulation, heat radiation capability, and radiation noise resistance includes circuit boards stacked in two layers and spaced apart from each other and surface panels of the IC card while maintaining satisfactory mechanical strength in the card. Board supporting portions extending in a frame portion of a main frame and sub-frames disposed on the board supporting portions hold the circuit boards, maintain a predetermined interval between the two circuit boards and between each circuit board and the surface panels, and provide the desired mechanical strength for the card.

REFERENCES:
patent: 3766439 (1973-10-01), Isaacson
patent: 4905124 (1990-02-01), Banjo et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

IC card and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with IC card and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC card and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-68986

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.