IC card and method of fabricating the same

Details IC card and method of fabricating the same IC card and method of fabricating the same

1997-04-24

1999-03-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361736, 361686, 361752, 361753, 257678, 257679, 257684, 257688, 257690, 174261, 174260, 174255, 174 522, 235488, 235489, 235492, 235441, 235486, H05K 0118

Patent

active

058779418

ABSTRACT:
An IC card and a method of fabricating the same are provided in which the IC card substrate is formed of a blackened metal core plate to improve thermal, electrical and mechanical stability of the IC card.

REFERENCES:
patent: 5013900 (1991-05-01), Hoppe
patent: 5272374 (1993-12-01), Kodai et al.
patent: 5374788 (1994-12-01), Endoh et al.
patent: 5502893 (1996-04-01), Endoh et al.
patent: 5612532 (1997-03-01), Iwasaki

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