IC card and manufacturing method thereof

Details IC card and manufacturing method thereof IC card and manufacturing method thereof

2005-06-28

2005-06-28

Lee, Diane I. (Department: 2876)

Registers

Records

Conductive

C235S487000

Reexamination Certificate

active

06910636

ABSTRACT:
An IC card includes an antenna circuit pattern formed on an insulation film and having a wire-shaped antenna portion, a portion corresponding to a chip bump of a combi-chip, and an attachment portion to which an external contact pad is attached. The combi-chip is attached to a portion corresponding to the chip bump of the combi-chip module on the antenna circuit pattern. At least one dielectric layer is attached to the antenna circuit pattern. An external contact pad is inserted in a hole formed in part of the dielectric layer and attached to the hole and has terminals formed in an outer surface and an inner surface of a substrate and connected to one another. The terminals on the inner surface contact the attachment portion is provided on the antenna circuit pattern.

REFERENCES:
patent: 4822988 (1989-04-01), Gloton
patent: 5612532 (1997-03-01), Iwasaki
patent: 5671525 (1997-09-01), Fidalgo
patent: 5903239 (1999-05-01), Takahashi et al.
patent: 6412702 (2002-07-01), Ishikawa et al.
patent: 6556175 (2003-04-01), Okamura et al.
patent: 6568600 (2003-05-01), Carpier et al.

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