IC card and manufacturing method thereof

Details IC card and manufacturing method thereof IC card and manufacturing method thereof

1998-05-20

2000-12-26

Gandhi, Jayprakash N.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361801, 1563063, H05K 714

Patent

active

061669121

ABSTRACT:
There is provided an IC card and manufacturing method thereof assuring a highly reliable fixed portion in fixing upper and lower panel members to a frame made of resin as well as an advantage in terms of manufacturing cost. In the IC card in which a pair of upper and lower panel members covering card planar portions are respectively fixed to the upper and the lower surfaces of a resin frame which supports a peripheral portion of an electric circuit board and a connector attached to an end portion of the electric circuit board, the panel members have their peripheral edge portions which are provided with a bent portion extending along the peripherial edge portions and are formed by bending the panel material at a specified angle, and a welding use resin layer is formed on the surface of the bent portion and the periphery of the planar portion of the panel member. On the other hand, the frame is provided with a groove portion for receiving therein the bent portion, and the welding use resin layer is melted in a pressurized state while making the welding use resin layer abut against the frame with the bent portion fitted in to the groove portion, thereby fixing the panel members to the frame.

REFERENCES:
patent: 5394298 (1995-02-01), Sagisaka
patent: 5453975 (1995-09-01), Ohta et al.
patent: 5597428 (1997-01-01), Matsumoto et al.
patent: 5968442 (1999-10-01), Sato et al.

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