Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Patent
1992-07-14
1994-04-05
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Within distinct housing spaced from panel circuit arrangement
235492, H01R 710
Patent
active
052999408
ABSTRACT:
An IC card is disclosed which would not be deformed, and hence, which maintains its quality reliability. A frame is provided to house a substrate which mounts ICs. Panels for protecting the ICs are fixed to the frame by first adhesive material layers. A connector is disposed, in contact with the substrate, between the panels. The connector is fixed to the frame by a second adhesive material layer. This prohibits that external force which acts on the connector at insertion and detachment of the IC card into and from external equipment from acting on the first adhesive material layers. Hence, insertion and detachment of the IC card do not cause deterioration in adhesion between the panels and the frame. Thus, deformation of the ICs due to the external force is prevented, thereby the quality reliability of the IC card being better maintained.
REFERENCES:
patent: 4729061 (1988-03-01), Brown
patent: 4780791 (1988-10-01), Morita et al.
patent: 5153818 (1992-10-01), Mukougawa et al.
Ikeda Yasumori
Maeda Hajime
Onoda Shigeo
Tachikawa Toru
Uenaka Takeshi
Abrams Neil
Mitsubishi Denki & Kabushiki Kaisha
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