IC card

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Patent

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Details

235492, G06K 1900

Patent

active

046970738

ABSTRACT:
In an IC card, contact pads 7A and wiring patterns 7B are formed on a sheet-like structure and contact segments 7-1 to 7-8 are formed on the contact pads 7A. Main chip 5 and sub-chip 6 are mounted on the sheet-like structure. A sheet film is laminated on the sheet-like structure and the contact segments are fitted in openings of the sheet film. The sheet film has a thickness substantially equal to that of the contact segments.

REFERENCES:
patent: 4592870 (1985-07-01), Chaum

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