IC card

Details IC card IC card

1991-01-30

1993-10-05

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428915, 428916, 428198, 283 77, 283 83, 283107, 283109, B32B 300

Patent

active

052503410

ABSTRACT:
In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.

REFERENCES:
patent: 3512286 (1970-05-01), Siegel
patent: 4245035 (1981-01-01), Poshkus
patent: 4417413 (1983-11-01), Hoppe et al.
patent: 4450024 (1984-05-01), Haghiri-Tehrane et al.
patent: 4617216 (1986-10-01), Haghiri-Tehrani
patent: 4879153 (1989-11-01), Ohashi et al.
patent: 4889749 (1989-12-01), Ohashi et al.
patent: 5026452 (1991-06-01), Kodai

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