IC card

Details IC card IC card

1986-09-18

1989-07-04

Salce, Patrick R.

Registers

Records

Conductive

235438, 235487, G06K 1906

Patent

active

048453510

ABSTRACT:
An IC including an EEP-ROM is formed on a semiconductor wafer. The IC also has exposed address pads connected to the address bus of the EEP-ROM, and exposed data pads connected to the data bus of the EEP-ROM. A test probe is brought into contact with these pads, thereby performing various tests on the IC. After the IC has been tested, the wafer is diced into IC pellets. The address pads are disconnected from the address bus and/or the data pads are disconnected from the data bus. For example, the edge portions of the IC pellet on which the address pads and/or the data pads are formed are cut by dicing from the remaining portion of the IC pellet. Thereafter, the connecting pads of the IC pellet are wire-bonded to leads, and the IC pellet is sealed with a resin. Finally, the sealed IC pellet is built in an IC card body.

REFERENCES:
patent: 3971916 (1976-07-01), Moreno
patent: 4105156 (1978-08-01), Dethloff
patent: 4446475 (1984-05-01), Gercekci et al.
patent: 4572946 (1986-02-01), Schrenk
patent: 4650975 (1987-03-01), Kitchener
patent: 4697073 (1987-09-01), Hara
IEEE Spectrum, vol. 21, No. 2, Feb. 1984; pp. 43-49.

Affiliated with

Also associated with

Rating

IC card does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with IC card, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC card will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-854633